Nvidia has begun securing advanced substrate capacity in Taiwan, Japan and South Korea, using capacity reservation agreements and upfront payments to support supplier expansion as next-generation AI accelerators…
Nvidia has begun securing advanced substrate capacity in Taiwan, Japan and South Korea, using capacity reservation agreements and upfront payments to support supplier expansion as next-generation AI accelerators ramp up. The move comes as the global packaging substrate market is projected to grow from US$14.9 billion in 2025 to US$40.2 billion in 2030, while demand for advanced ABF build-up materials is expected to exceed supply from 2027.
This is a source-linked briefing. Read the original report from Digitimes .